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Proceedings Paper

Metrology and instrumentation challenges with high-rate, roll-to-roll manufacturing of flexible electronic systems
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Paper Abstract

In this paper, we discuss the metrology and instrumentation challenges that need to be overcome in order to realize true implementation of roll-to-roll manufacturing of flexible electronic systems. Several metrology and instrumentation challenges involved such as availability of particulate-free high quality substrate, development and implementation of high-speed in-line and off-line inspection and diagnostic tools with adaptive control for patterned and unpatterned material films, development of reliable hardware, etc need to be addressed and overcome in order to realize a successful manufacturing process. Due to extreme resolution requirements compared to print media, the burden of software and hardware tools on the throughput also needs to be carefully determined. Moreover, the effect of web wander and variations in web speed need to accurately be determined in the design of the system hardware and software. Realization of successful metrology and instrumentation by overcoming the challenges for the development of a roll-to-roll manufacturing system for flexible electronic systems opens limitless possibilities for the deployment of high performance flexible electronic components in a variety of applications including communication, sensing, medicine, agriculture, energy, lighting etc.

Paper Details

Date Published: 11 October 2012
PDF: 8 pages
Proc. SPIE 8466, Instrumentation, Metrology, and Standards for Nanomanufacturing, Optics, and Semiconductors VI, 846603 (11 October 2012); doi: 10.1117/12.940778
Show Author Affiliations
Harish Subbaraman, Omega Optics, Inc. (United States)
Xiaohui Lin, The Univ. of Texas at Austin (United States)
Xiaochuan Xu, The Univ. of Texas at Austin (United States)
Ananth Dodabalapur, The Univ. of Texas at Austin (United States)
L. Jay Guo, Univ. of Michigan (United States)
Ray T. Chen, The Univ. of Texas at Austin (United States)


Published in SPIE Proceedings Vol. 8466:
Instrumentation, Metrology, and Standards for Nanomanufacturing, Optics, and Semiconductors VI
Michael T. Postek; Victoria A. Coleman; Ndubuisi G. Orji, Editor(s)

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