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Proceedings Paper

The Infrared Automatic Mass Screening (IRAMS) System For Printed Circuit Board Fault Detection
Author(s): Perry W. Hugo
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Paper Abstract

Office of the Program Manager for TMDE (OPM TMDE) has initiated a program to develop techniques for evaluating the performance of printed circuit boards (PCB's) using infrared thermal imaging. It is OPM TMDE's expectation that the standard thermal profile (STP) will become the basis for the future rapid automatic detection and isolation of gross failure mechanisms on units under test (UUT's). To accomplish this OPM TMDE has purchased two Infrared Automatic Mass Screening ( I RAMS) systems which are scheduled for delivery in 1987. The IRAMS system combines a high resolution infrared thermal imager with a test bench and diagnostic computer hardware and software. Its purpose is to rapidly and automatically compare the thermal profiles of a UUT with the STP of that unit, recalled from memory, in order to detect thermally responsive failure mechanisms in PCB's. This paper will review the IRAMS performance requirements, outline the plan for implementing the two systems and report on progress to date.

Paper Details

Date Published: 11 May 1987
PDF: 6 pages
Proc. SPIE 0780, Thermosense IX: Thermal Infrared Sensing for Diagnostics and Control, (11 May 1987); doi: 10.1117/12.940504
Show Author Affiliations
Perry W. Hugo, Army Test Measurement and Diagnostic Technology Office (United States)


Published in SPIE Proceedings Vol. 0780:
Thermosense IX: Thermal Infrared Sensing for Diagnostics and Control
Robert P. Madding, Editor(s)

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