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Proceedings Paper

A Contactless 3-D Measuring Technique For IC Inspection
Author(s): Bernard C. Breton; John T . L . Thong; William C. Nixon
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Paper Abstract

Digital filtering techniques have been combined with a scanning electron microscope to provide noise free, TV rate stereo images over the full magnification range of the SEM, giving a qualitative pseudo 3-D representation of the sample surface. In this paper, a development of this technique will be described which permits quantitative measurement of a surface in 3 dimensions. Image correlation techniques have been derived which, when coupled with the lens controls of the SEM in the form of a feedback loop, permit automatic profiling of small structures. The technique has potential applications to a range of integrated circuit inspection techniques including resist profiling and critical dimension measurements.

Paper Details

Date Published: 17 April 1987
PDF: 11 pages
Proc. SPIE 0775, Integrated Circuit Metrology, Inspection, & Process Control, (17 April 1987); doi: 10.1117/12.940417
Show Author Affiliations
Bernard C. Breton, Cambridge University (England)
John T . L . Thong, Cambridge University (England)
William C. Nixon, Cambridge University (England)


Published in SPIE Proceedings Vol. 0775:
Integrated Circuit Metrology, Inspection, & Process Control
Kevin M. Monahan, Editor(s)

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