Share Email Print

Proceedings Paper

Laser Processing For Application Specific Integrated Circuits (ASICs)
Author(s): Donald V. Smart; Donald M. Stewart
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

ASIC devices can be programmed by lasers using two techniques - a photochemical approach to direct-write connections or localized heating of the circuits by a laser spot to cut or form link structures. The technique to cut links is a mature process based on cutting similar link structures used to repair memory devices with redundant circuitry. The link-cutting process described here provides a 90% or higher programming yield on a 100,000 link ASIC based on specific process recommendations including optical verification of link cutting performance.

Paper Details

Date Published: 1 September 1987
PDF: 5 pages
Proc. SPIE 0774, Lasers in Microlithography, (1 September 1987); doi: 10.1117/12.940392
Show Author Affiliations
Donald V. Smart, Teradyne, Incorporated (United States)
Donald M. Stewart, Teradyne, Incorporated (United States)

Published in SPIE Proceedings Vol. 0774:
Lasers in Microlithography
John Samuel Batchelder; Daniel J. Ehrlich; Jeff Y. Tsao, Editor(s)

© SPIE. Terms of Use
Back to Top