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Proceedings Paper

Laser Processing For Application Specific Integrated Circuits (ASICs)
Author(s): Donald V. Smart; Donald M. Stewart
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Paper Abstract

ASIC devices can be programmed by lasers using two techniques - a photochemical approach to direct-write connections or localized heating of the circuits by a laser spot to cut or form link structures. The technique to cut links is a mature process based on cutting similar link structures used to repair memory devices with redundant circuitry. The link-cutting process described here provides a 90% or higher programming yield on a 100,000 link ASIC based on specific process recommendations including optical verification of link cutting performance.

Paper Details

Date Published: 1 September 1987
PDF: 5 pages
Proc. SPIE 0774, Lasers in Microlithography, (1 September 1987); doi: 10.1117/12.940392
Show Author Affiliations
Donald V. Smart, Teradyne, Incorporated (United States)
Donald M. Stewart, Teradyne, Incorporated (United States)

Published in SPIE Proceedings Vol. 0774:
Lasers in Microlithography
John Samuel Batchelder; Daniel J. Ehrlich; Jeff Y. Tsao, Editor(s)

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