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Proceedings Paper

High Speed Device Testing And Internal Node Diagnostics
Author(s): George Chiu; Jean-Marc Halbout; Paul May
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Paper Abstract

The performance of micron and submicron devices and chips for the coming decade is advancing at a rapid pace. The requirements to test these ultrafast, small, and dense circuits give rise to great challenges for high speed testing. Methodology to meet these challenges and yet unsolved forthcoming problems are discussed.

Paper Details

Date Published: 1 September 1987
PDF: 9 pages
Proc. SPIE 0774, Lasers in Microlithography, (1 September 1987); doi: 10.1117/12.940385
Show Author Affiliations
George Chiu, International Business Machines Corporation (United States)
Jean-Marc Halbout, International Business Machines Corporation (United States)
Paul May, International Business Machines Corporation (United States)


Published in SPIE Proceedings Vol. 0774:
Lasers in Microlithography
John Samuel Batchelder; Daniel J. Ehrlich; Jeff Y. Tsao, Editor(s)

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