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Proceedings Paper

Lower Defect Photomasks Using Focused Ion Beam (Fib) Repair
Author(s): Terri D. Cambria
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Paper Abstract

The characteristics of a photomask repaired with a focused ion beam (FIB) are described. The edge-placement accuracy of the repair is +0.1 um, while the edge roughness is almost negligible for both clear and opaque repairs. Less than 3% of the repair sites are captured on an automatic photomask inspection system. Correlation between linewidth measurements on the photomask and wafers printed on a projection aligner show that variations of the line-edge are well within the +0.1 um placement accuracy of the FIB repair system. This means that truly zero-defect plates are possible with repair CD's the same as the lithography CD's.

Paper Details

Date Published: 30 June 1987
PDF: 8 pages
Proc. SPIE 0773, Electron-Beam, X-Ray, and Ion-Beam Lithographies VI, (30 June 1987); doi: 10.1117/12.940359
Show Author Affiliations
Terri D. Cambria, Micrion Corporation (United States)


Published in SPIE Proceedings Vol. 0773:
Electron-Beam, X-Ray, and Ion-Beam Lithographies VI
Phillip D. Blais, Editor(s)

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