Share Email Print

Proceedings Paper

Versatile X-Ray Mask Fabrication Techniques
Author(s): Katsumi Suzuki
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

A novel X-ray mask fabrication process, which is as simple as that used for conventional photomasks, has been developed. Several step and repeat X-ray lithography masks with SIN, membranes, which are stretched over rectangular rigid Si-frames, are fabricated from the same large wafer. Transparent window formations fot several tens of X-ray mask substrates are carried out simultaneously, by etching the (100) oriented Si wafers in KOH solution using no protection. V-grooves with (111) plane side walls, for dividing individual wafers into individual X-ray mask substrates, are simultaneously formed by the unisotropic etching. X-ray absorber patterns are fabricated on the SiNv membrane with rf-sputtered tungsten, by the subtractive method. Employing the present method, SIN, mask blanks, with less than 0.3μm warpage across a 26mm square window, have been fabricat&I with several tens of times higher throughput than can be achieved by the conventional process.

Paper Details

Date Published: 30 June 1987
PDF: 7 pages
Proc. SPIE 0773, Electron-Beam, X-Ray, and Ion-Beam Lithographies VI, (30 June 1987); doi: 10.1117/12.940349
Show Author Affiliations
Katsumi Suzuki, NEC Corporation (Japan)

Published in SPIE Proceedings Vol. 0773:
Electron-Beam, X-Ray, and Ion-Beam Lithographies VI
Phillip D. Blais, Editor(s)

© SPIE. Terms of Use
Back to Top