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Proceedings Paper

Applications Of The Mold Controlled Profile (MCP) Technique For Resist Processing
Author(s): Burn J. Lin
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Paper Abstract

The Mold Controlled Profile (MCP) technique consists of coating a layer of immiscible polymer over a prepatterned resist image. This structure can be heated to an extremely high temperature without lateral distortion of the original resist profile, while the patterned resist undergoes significant chemical changes. After removal of the mold, the resultant image can be used in many areas of application. Here, the hardening aspect and the compensation of interfacial layer in the capped deep-uv Portable Conformable Masking (PCM) system are given to demonstrate the advantages of the MCP technique and to stimulate other new applications.

Paper Details

Date Published: 25 August 1987
PDF: 6 pages
Proc. SPIE 0771, Advances in Resist Technology and Processing IV, (25 August 1987); doi: 10.1117/12.940324
Show Author Affiliations
Burn J. Lin, IBM (United States)

Published in SPIE Proceedings Vol. 0771:
Advances in Resist Technology and Processing IV
Murrae J. Bowden, Editor(s)

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