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Proceedings Paper

Characterization Of Thin-Film Adhesion With The Scanning Acoustic Microscope
Author(s): R. C. Addison; M. Somekh; J. M. Rowe; G. A . D. Briggs
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Paper Abstract

Films and coatings are integral elements of devices used for a variety of purposes in engineering, electronic, optical and other applications. The performance, functional characteristics, and structural properties of the devices all depend on the adhesion between the film and substrate. Adhesion measurement techniques that are currently available are not comparable from one laboratory to another, nor are there any techniques that are noncontacting, quantitative and reliable. In our work, surface acoustic waves (SAWs) are used to introduce stresses between the films and their substrates. Regions of the film having weak bonding forces will produce a different response than the regions having strong bonding forces. The response is measured as a change in the velocity of the waves. The waves are excited on the substrate with a high numerical aperture cylindrical lens. The V(z) response of the film system is then obtained and processed to extract the SAW velocity. The results of these measurements on a film system with known regions of strong and weak adhesion will be presented. These measurements will be compared to simulations of the change in surface wave velocity as the bond stiffness be the film and substrate is changed.

Paper Details

Date Published: 10 September 1987
PDF: 10 pages
Proc. SPIE 0768, Pattern Recognition and Acoustical Imaging, (10 September 1987); doi: 10.1117/12.940278
Show Author Affiliations
R. C. Addison, Rockwell International Science Center (United States)
M. Somekh, University College London (England)
J. M. Rowe, Oxford University (England)
G. A . D. Briggs, Oxford University (England)

Published in SPIE Proceedings Vol. 0768:
Pattern Recognition and Acoustical Imaging
Leonard A. Ferrari, Editor(s)

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