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Proceedings Paper

Transient Thermoreflectance Studies Of Thermal Transport Across Metal�Metal Interfaces
Author(s): Carolyn A Paddock; Gary L Eesley; Bruce M Clemens; James P Stec
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Paper Abstract

We measure the thermal impedance of an interface in a thin metallic film using picosec-ond transient thermoreflectance. Our measurements on sputtered nickel-copper (Ni-Cu), nickel-molybdenum (Ni-Mo), nickel-titanium (Ni-Ti), and nickel-zirconium (Ni-Zr) indicate that the thermal impedance of the interface is directly related to the atomic size mismatch of the constituent elements. The interface decreases the thermal diffusion in the film compared to that measured for the constituent single element films.

Paper Details

Date Published: 23 December 1986
PDF: 7 pages
Proc. SPIE 0678, Optical Thin Films II: New Developments, (23 December 1986); doi: 10.1117/12.939539
Show Author Affiliations
Carolyn A Paddock, General Motors Research Laboratories (United States)
Gary L Eesley, General Motors Research Laboratories (United States)
Bruce M Clemens, General Motors Research Laboratories (United States)
James P Stec, General Motors Research Laboratories (United States)


Published in SPIE Proceedings Vol. 0678:
Optical Thin Films II: New Developments
Richard Ian Seddon, Editor(s)

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