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Proceedings Paper

X-Ray Lithography Alignment System
Author(s): B Fay; W T Novak
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Paper Abstract

An automatic X-ray alignment/exposure system developed for VLSI application involving printed linewidths in the one micron and submicron range is described. This paper focuses on the automatic alignment system designed to meet the specific overlay requirements for such applications. Other key elements of this fully automated, high throughput wafer exposure system are briefly presented.

Paper Details

Date Published: 19 March 1984
PDF: 6 pages
Proc. SPIE 0448, X-Ray Lithography and Applications of Soft X-Rays to Technology, (19 March 1984); doi: 10.1117/12.939213
Show Author Affiliations
B Fay, Micronix Corporation (United States)
W T Novak, Micronix Corporation (United States)

Published in SPIE Proceedings Vol. 0448:
X-Ray Lithography and Applications of Soft X-Rays to Technology
Alan D. Wilson, Editor(s)

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