Share Email Print
cover

Proceedings Paper

Soft X-Ray Photoemission Techniques For Characterizing Metal-Semiconductor Interfaces
Author(s): L J Brillson
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

The wide energy range and tunability of synchrotron radiation provide soft x-ray photoemission spectroscopy (SXPS) with several effective methods for characterizing metal-semiconductor interfaces on an atomic scale. These SXPS techniques reveal that metal-semiconductor interfaces are in general not abrupt and that the detailed atomic structure is a controlling factor in determining interface electronic structure.

Paper Details

Date Published: 27 March 1984
PDF: 13 pages
Proc. SPIE 0447, Science with Soft X-Rays, (27 March 1984); doi: 10.1117/12.939185
Show Author Affiliations
L J Brillson, Xerox Webster Research Center (United States)


Published in SPIE Proceedings Vol. 0447:
Science with Soft X-Rays
Roger W. Klaffky; F. J. Himpsel, Editor(s)

© SPIE. Terms of Use
Back to Top