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Proceedings Paper

Failure Analysis Of Multilayer Printed Circuit Boards Using Thermography
Author(s): H R Stirn
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Paper Abstract

Modern electronic equipment presents new challenges for troubleshooting and repair to the manufacturing and test community. Higher circuit density and increased device sophistication requires that innovative new methods be developed for troubleshooting and repair. Expensive and delicate printed circuit boards cannot survive numerous part removal and replacement actions. Component and board defects must be isolated quickly, accurately and efficiently so that repairs may be made with minimum disruption to the board circuitry. Infrared digital thermography offers the promise of helping to solve some of these problems.

Paper Details

Date Published: 27 March 1984
PDF: 6 pages
Proc. SPIE 0446, Thermosense VI: Thermal Infrared Sensing for Diagnostics and Control, (27 March 1984); doi: 10.1117/12.939164
Show Author Affiliations
H R Stirn, Westinghouse Electric Corporation (United States)

Published in SPIE Proceedings Vol. 0446:
Thermosense VI: Thermal Infrared Sensing for Diagnostics and Control
Gordon J. Burrer, Editor(s)

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