Share Email Print
cover

Proceedings Paper

Heat Loss Due To Thermal Bridges In Buildings
Author(s): J B Fang; R A tarot; K W. Childs; G. E. Courville
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

Building envelopes often contain numerous highly conductive heat flow paths, called thermal bridges, which are major sources of heat loss and deterioration of building materials due to moisture condensation. Some examples of thermal bridges occurring in office buildings are presented. Infrared thermography was used to identify the locations and magnitudes of thermally defective areas resulting from inadequate construction, design, or substandard workmanship in existing buildings. Due to the large thermal inertia of building components and transient conditions caused by fluctuating outdoor and indoor temperatures, long measurement periods are required. This makes thermography impractical for quantifying the heat loss. In order to estimate the heat loss rate from thermal bridges and to obtain a better understanding of the physical processes involved, a two-dimensional heat flow model has been developed for transient heat conduction within the exterior wall/intermediate floor systems. The calculated results from the mathematical model are compared with available experimental data. An in-situ measurement technique, which is currently under development at NBS for quantifying the energy loss due to thermal bridges, is described.

Paper Details

Date Published: 27 March 1984
PDF: 9 pages
Proc. SPIE 0446, Thermosense VI: Thermal Infrared Sensing for Diagnostics and Control, (27 March 1984); doi: 10.1117/12.939140
Show Author Affiliations
J B Fang, National Bureau of Standards (United States)
R A tarot, National Bureau of Standards (United States)
K W. Childs, Oak Ridge National Laboratory (United States)
G. E. Courville, Oak Ridge National Laboratory (United States)


Published in SPIE Proceedings Vol. 0446:
Thermosense VI: Thermal Infrared Sensing for Diagnostics and Control
Gordon J. Burrer, Editor(s)

© SPIE. Terms of Use
Back to Top