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Proceedings Paper

Laser Holographic Inspection Of Solder Joints On Printed Circuit Board (PCB)
Author(s): Hong Jing; Geng Wanzhen; Jiang Lingzhen; Xue Wei; Ma Jing; Zhao Shijie; Yang Jingfeng
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Paper Abstract

The principle of inspecting solder joints by holographic interferometric technique is introduced. The criterion of discriminating the flaws is suggested. The results are given and testified by metallographical sectioning.

Paper Details

Date Published: 15 January 1988
PDF: 4 pages
Proc. SPIE 0673, Holography Applications, (15 January 1988); doi: 10.1117/12.939057
Show Author Affiliations
Hong Jing, Harbin Institute of Technology (China)
Geng Wanzhen, Harbin Institute of Technology (China)
Jiang Lingzhen, Harbin Institute of Technology (China)
Xue Wei, Harbin Institute of Technology (China)
Ma Jing, Harbin Institute of Technology (China)
Zhao Shijie, Harbin Institute of Technology (China)
Yang Jingfeng, Harbin Institute of Technology (China)


Published in SPIE Proceedings Vol. 0673:
Holography Applications
Jingtang Ke; Ryszard J. Pryputniewicz, Editor(s)

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