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Proceedings Paper

Profile Measurement On IC Wafers By Holographic Interference
Author(s): Jing Ao Sun; Anni Cai; Glen Wade
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Paper Abstract

We present here a new technique of holographic interferometry for profile inspection of integrated circuit (IC) wafers. With this technique the lateral resolution of the profilometer will not be affected by the limitations on optical aperture. In addition, there are no stringent requirements on the spot size of the laser irradiation. A principal advantage of this system is that it needs no magnifying elements to give reasonable resolution for lateral measurements. Also the system will work even if multiple reflections exist.

Paper Details

Date Published: 15 January 1988
PDF: 9 pages
Proc. SPIE 0673, Holography Applications, (15 January 1988); doi: 10.1117/12.939050
Show Author Affiliations
Jing Ao Sun, University of California (United States)
Anni Cai, University of California (United States)
Glen Wade, University of California (United States)

Published in SPIE Proceedings Vol. 0673:
Holography Applications
Jingtang Ke; Ryszard J. Pryputniewicz, Editor(s)

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