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Proceedings Paper

Holographic Inspection Of Printed Circuit Board
Author(s): K. A. Arunkumar; J. D. Trolinger; S. Hall; D. Cooper
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Paper Abstract

The possibility of using real time holographic interferometry (HI) to detect defects in printed circuit boards has been explored. Initial results indicate that real time HI can reveal some of the most common PC board defects such as solder crack, desoldered junctions, trace separation and components snipped at the soldered joints. In this study, thermal stressing was used as the probe since it did not require the board to be powered, and hence, allows the PCB test mounts to be simple. Our studies also indicate that holographic interferometry can detect and pinpoint more than one defect if present in the field of view.

Paper Details

Date Published: 8 December 1986
PDF: 5 pages
Proc. SPIE 0693, High Speed Photography, Videography, and Photonics IV, (8 December 1986); doi: 10.1117/12.936745
Show Author Affiliations
K. A. Arunkumar, Spectron Development Laboratories,Inc. (United States)
J. D. Trolinger, Spectron Development Laboratories,Inc. (United States)
S. Hall, AFWAL/FIEE (United States)
D. Cooper, AFWAL/FIEE (United States)

Published in SPIE Proceedings Vol. 0693:
High Speed Photography, Videography, and Photonics IV
Bernard G. Ponseggi, Editor(s)

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