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Proceedings Paper

Full field stress analysis using the thermoelastic principle
Author(s): Lionel R. Baker; David E. Oliver
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Paper Abstract

This paper describes a new method of measuring stress on the surface of a structure subjected to dynamic loading. Although the theoretical relationship between the changes in temperature at a point on the surface and the related change in stress has been known for over 100 years, it has only recently been possible to measure reliably and without contact the small changes in temperature down to 0.001°K involved. The performance characteristics of an instrument for Stress Pattern Analysis by measurement of Thermal Emission (SPATE) and the results of measurements on real structures recently obtained will be described.

Paper Details

Date Published: 10 December 1986
PDF: 10 pages
Proc. SPIE 0685, Infrared Technology XII, (10 December 1986); doi: 10.1117/12.936492
Show Author Affiliations
Lionel R. Baker, Sira Ltd (United Kingdom)
David E. Oliver, Ometron Inc (United States)

Published in SPIE Proceedings Vol. 0685:
Infrared Technology XII
Richard A. Mollicone; Irving J. Spiro, Editor(s)

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