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Proceedings Paper

Performance Of Merck Selectilux P Positive Photoresist In Aluminium Plasma Etching And High Current Ion Implantation
Author(s): Klaus Thiel
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Paper Abstract

Recently, Merck has introduced a new novolak resin based positive resist system with improved performance in VLSI semiconductor processing. Performance data is presented in some detail. Topics stressed include the performance during aluminium etching using chlorine containing plasma and high current ion implantation. It will be shown that excellent performance can be obtained using certain processing techniques when severe thermal/reactive plasma environments are encountered.

Paper Details

Date Published: 7 November 1983
PDF: 9 pages
Proc. SPIE 0394, Optical Microlithography II: Technology for the 1980s, (7 November 1983); doi: 10.1117/12.935129
Show Author Affiliations
Klaus Thiel, E. Merck (West Germany)


Published in SPIE Proceedings Vol. 0394:
Optical Microlithography II: Technology for the 1980s
Harry L. Stover, Editor(s)

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