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Proceedings Paper

Electron Beam Systems At IBM Status Report
Author(s): Edward V. Weber
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Paper Abstract

For over ten years IBM has been pursuing Manufacturing Electron Beam Systems in Manufacturing for direct wafer lithography exposure. These efforts have resulted in three generations of systems for wafer exposure, each with a greater capability. These systems have been configured to minimize system ailments and to maximize throughput. Their principal application has been to reduce turn around time. They have provided satisfactory service in Manufacturing and in Development applications. Having proved themselves to be beneficial and reliable Manufacturing tools, electron beams are being implemented for additional applications. Mask exposure, mask inspection and module inspection are some of the newer applications for E-Beam systems, in IBM at East Fishkill.

Paper Details

Date Published: 7 November 1983
PDF: 6 pages
Proc. SPIE 0393, Electron-Beam, X-Ray and Ion-Beam Techniques for Submicron Lithographies II, (7 November 1983); doi: 10.1117/12.935093
Show Author Affiliations
Edward V. Weber, IBM General Technology Division (United States)

Published in SPIE Proceedings Vol. 0393:
Electron-Beam, X-Ray and Ion-Beam Techniques for Submicron Lithographies II
Phillip D. Blais, Editor(s)

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