Share Email Print
cover

Proceedings Paper

Multilayer Resist Systems Using Polysiloxanes As Etch Masks
Author(s): J. Paraszczak; J. Shaw; M. Hatzakis; E. Babich; E. Arthur
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Abstract

Radiation imageable polysiloxanes have many outstanding properties, among which are their resistance to etching in oxygen plasmas, the ability to apply them from solution by spinning or spraying and their high thermal stability. This paper describes the use of these materials in generating high aspect ratio patterns using the polysiloxanes in two and three layer systems.

Paper Details

Date Published: 7 November 1983
PDF: 12 pages
Proc. SPIE 0393, Electron-Beam, X-Ray and Ion-Beam Techniques for Submicron Lithographies II, (7 November 1983); doi: 10.1117/12.935088
Show Author Affiliations
J. Paraszczak, IBM T. J. Watson Research Center (United States)
J. Shaw, IBM T. J. Watson Research Center (United States)
M. Hatzakis, IBM T. J. Watson Research Center (United States)
E. Babich, IBM T. J. Watson Research Center (United States)
E. Arthur, IBM T. J. Watson Research Center (United States)


Published in SPIE Proceedings Vol. 0393:
Electron-Beam, X-Ray and Ion-Beam Techniques for Submicron Lithographies II
Phillip D. Blais, Editor(s)

© SPIE. Terms of Use
Back to Top