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Proceedings Paper

3-D Profile Detection Of Etched Patterns Using A Laser Scanner (3D-SCAN DETECTION) For Automatic Inspection Of Printed Circuit Boards
Author(s): Moritoshi Ando; Kikuo Mita; Yoshikazu Kakinoki; Takefumi Inagaki
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Paper Abstract

A new detection method named 3D-SCAN DETECTION has been developed. The method can detect three dimensional profiles of etched pattern on an inner layer of multilayer printed circuit boards (PC boards). In this system, one scanning of a laser beam allows the simultaneous detection of both top and bottom widths of an etched pattern (standard width and thickness: 100 x 35 μm) to within an accuracy of 10 pm. A prototype of 3D-SCAN DETECTION has been experimentally confirmed to have sufficient performance for the detection of such flaws as nicks in a copper pattern and poor spacing between adjacent conductors.

Paper Details

Date Published: 3 October 1983
PDF: 9 pages
Proc. SPIE 0389, Optical Systems Engineering III, (3 October 1983); doi: 10.1117/12.935024
Show Author Affiliations
Moritoshi Ando, Fujitsu Laboratories Ltd. (Japan)
Kikuo Mita, Fujitsu Laboratories Ltd. (Japan)
Yoshikazu Kakinoki, Fujitsu Laboratories Ltd. (Japan)
Takefumi Inagaki, Fujitsu Laboratories Ltd. (Japan)


Published in SPIE Proceedings Vol. 0389:
Optical Systems Engineering III
William H. Taylor, Editor(s)

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