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Proceedings Paper

Maskless Laser Plating Techniques For Microelectronic Materials
Author(s): R. J. von Gutfeld; M. H. Gelchinski; L. T. Romankiw
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Paper Abstract

We describe techniques for laser enhanced plating of gold, nickel and copper. This maskless plating results in speeds up to 103 times that of conventional plating. Mechanisms and applications are discussed.

Paper Details

Date Published: 9 August 1983
PDF: 2 pages
Proc. SPIE 0385, Laser Processing of Semiconductor Devices, (9 August 1983); doi: 10.1117/12.934964
Show Author Affiliations
R. J. von Gutfeld, IBM T. J. Watson Research Laboratory (United States)
M. H. Gelchinski, IBM T. J. Watson Research Laboratory (United States)
L. T. Romankiw, IBM T. J. Watson Research Laboratory (United States)


Published in SPIE Proceedings Vol. 0385:
Laser Processing of Semiconductor Devices
Charles C. Tang, Editor(s)

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