Share Email Print
cover

Proceedings Paper

Laser Applications To Semiconductor Device Processing
Author(s): Rajiv R. Shah
Format Member Price Non-Member Price
PDF $17.00 $21.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

Laser applications to the thermal processing of integrated circuits may be divided into two broad categories: one, applications to the improvement of existing process steps and, two, applications to processes that will allow fabrication of novel device structures. This paper will briefly review these applications, discuss potential problems in the use of lasers for device processing and possible solutions to these problems.

Paper Details

Date Published: 9 August 1983
PDF: 8 pages
Proc. SPIE 0385, Laser Processing of Semiconductor Devices, (9 August 1983); doi: 10.1117/12.934940
Show Author Affiliations
Rajiv R. Shah, Texas Instruments, Inc. (United States)


Published in SPIE Proceedings Vol. 0385:
Laser Processing of Semiconductor Devices
Charles C. Tang, Editor(s)

© SPIE. Terms of Use
Back to Top