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Proceedings Paper

Automatic Visual Inspection Applied To Silicon Chip Packaging
Author(s): W. G. L. Adaway
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Paper Abstract

This paper discusses the architecture and algorithms of an image processing system designed to precisely locate and inspect silicon dice and thus guide a pick and place mechanism in an automatic chip packaging system. The CRS1000 image processing system uses a Motorola 68000 microprocessor in a flexible bus-oriented architecture which provides for the addition of high-speed hardware processors. Transformation of the image into an edge map allows the position and orientation of the die to be reliably and accurately measured.

Paper Details

Date Published: 10 August 1983
PDF: 5 pages
Proc. SPIE 0376, Optical Sensing: Techniques, Benefits, Costs, (10 August 1983); doi: 10.1117/12.934733
Show Author Affiliations
W. G. L. Adaway, Computer Recognition Systems Ltd. (England)

Published in SPIE Proceedings Vol. 0376:
Optical Sensing: Techniques, Benefits, Costs
S. J. Bennett, Editor(s)

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