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Proceedings Paper

Phenomenological Description Of Thin Film Interdiffusion
Author(s): S. Nakahara
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Paper Abstract

A basic principle of thin-film interdiffusion phenomenon is described. An emphasis is placed on the type of microstructural modifications occurring in diffusion zones during the interdiffusion processes. These structural changes are discussed in relation to intermetallic compound formation, diffusion-induced high stresses, and diffusion-induced grain boundary migration.

Paper Details

Date Published: 15 September 1982
PDF: 9 pages
Proc. SPIE 0346, Thin Film Technologies and Special Applications, (15 September 1982); doi: 10.1117/12.933789
Show Author Affiliations
S. Nakahara, Bell Laboratories (United States)

Published in SPIE Proceedings Vol. 0346:
Thin Film Technologies and Special Applications
William R. Hunter, Editor(s)

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