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Proceedings Paper

Multispectral Linear Array Focal Plane
Author(s): J. A. Hall; F. C. Blaha; R. C. McKee
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Paper Abstract

This paper discusses the conceptual design of a focal plane for a spaceborne instrument that provides six rows of visible and shortwave infrared sensing elements on two intimately assembled rows of detector chips. The six color bands are all within 20 IFOV in the along track direction. This unified "silicon based" focal plane uses interference spectral filters deposited directly on a linear array of buried channel CCD visible detector chips and palladium silicide back-biased Schottky diode SWIR detector chips. The paper will emphasize the technology associated with detector arrays and deposited stripe filters. The multispectral sensing focal plane design described here was developed partly on Westinghouse funds and partly under subcontract in support of the Eastman Kodak Multispectral Line Array Instrument Definition Study, Contract NAS5-26589, and experimental evaluation of the design technology was supported in part under contract NAS5-25622, Stripe Filters on Multispectral Linear Arrays. (This paper is one of a group of three related Westinghouse papers with 345-14, Multispectral Linear Array Focal Plane Signal Processing, and paper 345-19, Multispectral Linear Array Focal Plane Mechanical and Thermal Design. The overall instrument concept for which this focal plane was designed is described in paper 345-02, Improved Earth Resources Sensing Instrument, by George Keene of Eastman Kodak.)

Paper Details

Date Published: 23 November 1982
PDF: 7 pages
Proc. SPIE 0345, Advanced Multispectral Remote Sensing Technology and Applications, (23 November 1982); doi: 10.1117/12.933779
Show Author Affiliations
J. A. Hall, Westinghouse Electric Corporation (United States)
F. C. Blaha, Westinghouse Electric Corporation (United States)
R. C. McKee, Westinghouse Electric Corporation (United States)

Published in SPIE Proceedings Vol. 0345:
Advanced Multispectral Remote Sensing Technology and Applications
Ken J. Ando, Editor(s)

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