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Proceedings Paper

Monitoring Wafer Stepper Performance With Electrical Test Structures
Author(s): M. A. Mitchell; V. Nagaswami
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Paper Abstract

Metal crossbridge electrical test structures have been used to characterize linewidth non-uniformities caused by lithographic systems and processing. Artifacts can complicate the interpretation of electrical linewidth results. Self-heating in crossbridges is an artifact which can cause errors of more than 15%. Self-heating increases as the linewidth decreases. A procedure for eliminating self-heating effects is discussed.

Paper Details

Date Published: 15 October 1982
PDF: 6 pages
Proc. SPIE 0342, Integrated Circuit Metrology I, (15 October 1982); doi: 10.1117/12.933683
Show Author Affiliations
M. A. Mitchell, Honeywell, Inc. (United States)
V. Nagaswami, Honeywell, Inc. (United States)

Published in SPIE Proceedings Vol. 0342:
Integrated Circuit Metrology I
Diana Nyyssonen, Editor(s)

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