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Proceedings Paper

Overlay Characterization Of Projection Aligners Using Electrical Probe Techniques
Author(s): C. P. Ausschnitt; T. A. Brunner; S. C. Yang
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Paper Abstract

We describe an approach to overlay measurement based upon well-known electrical probe techniques. The advantages realized by our approach are process simplicity, measurement precision of ±0.01μm, independence from imagery and process variations, site-by-site accuracy verification, and the capability of performing many successive overlay evaluations on a single reference wafer. We present the results of overlay performance evaluations of state-of-the-art 1:1 projection printers, including alignment and distortion components and the variable magnification capability.

Paper Details

Date Published: 15 October 1982
PDF: 8 pages
Proc. SPIE 0342, Integrated Circuit Metrology I, (15 October 1982); doi: 10.1117/12.933681
Show Author Affiliations
C. P. Ausschnitt, Optical Group Research (United States)
T. A. Brunner, Optical Group Research (United States)
S. C. Yang, Optical Group Research (United States)

Published in SPIE Proceedings Vol. 0342:
Integrated Circuit Metrology I
Diana Nyyssonen, Editor(s)

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