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Proceedings Paper

Method Of Characterizing Wafer Steppers
Author(s): Chris Van Peski
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Paper Abstract

Characterizing wafer exposure equipment is becoming more important with the increasing use of such equipment. The process of fully characterizing a wafer stepper involves making several hundred measurements to sub-micron tolerances. This paper describes a method of using the automatic reticle-to-wafer aligner to collect the large number of measurements necessary for system characterization. The analysis method involves exposing an array of alignment targets, and then measuring the X-Y coordinates of the targets using the automatic aligner. Using this method, it is possible to obtain precise X-Y coordinate data at the rate of thirty measurements per minute. The coordinate data is recorded on tape cassette and transferred to a desk-top computer for data reduction. The data is analyzed to determine the error contribution of each of a number of systematic error sources. Typical data for a number of systems is presented, and the data reduction method is described. One primary application for this method is to characterize level-dedicated production wafer exposure systems.

Paper Details

Date Published: 15 October 1982
PDF: 5 pages
Proc. SPIE 0342, Integrated Circuit Metrology I, (15 October 1982); doi: 10.1117/12.933680
Show Author Affiliations
Chris Van Peski, TRE Semiconductor Equipment Corporation (United States)

Published in SPIE Proceedings Vol. 0342:
Integrated Circuit Metrology I
Diana Nyyssonen, Editor(s)

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