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Proceedings Paper

Inspection In The Third Dimension: Metal Mask Inspection Problems
Author(s): Joseph E. Levine; Donald A. MacKinnon
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Paper Abstract

The thermal conduction module (TCM) used in the IBM 3081 processor series incorporates a 90mm square multilayer ceramic substrate which requires thin metal masks for thick film personalization. The LSI semiconductors used on the TCM's require similar masks. These masks require accurately located features and precise cavity geometries and surface characteristics. The type of mask encountered in manufacturing is described, and the current inspection, measurement, and data handling techniques are discussed. The need for an improved inspection system is highlighted.

Paper Details

Date Published: 15 October 1982
PDF: 10 pages
Proc. SPIE 0342, Integrated Circuit Metrology I, (15 October 1982); doi: 10.1117/12.933678
Show Author Affiliations
Joseph E. Levine, IBM General Technology Division (United States)
Donald A. MacKinnon, IBM General Technology Division (United States)


Published in SPIE Proceedings Vol. 0342:
Integrated Circuit Metrology I
Diana Nyyssonen, Editor(s)

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