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Proceedings Paper

Reactive Sputter Etching And Its Applications
Author(s): Sasson Somekh
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Paper Abstract

The requirements for high-fidelity, anisotropic etching are discussed. A brief discussion on the various dry etch techniques available is followed by a description of a batch reactive sputter etch system that fulfills all patterning requirements. Examples of results obtained with this system are given and demonstrated with SEM photographs.

Paper Details

Date Published: 13 September 1982
PDF: 7 pages
Proc. SPIE 0334, Optical Microlithography I: Technology for the Mid-1980s, (13 September 1982); doi: 10.1117/12.933574
Show Author Affiliations
Sasson Somekh, Applied Materials, Inc. (United States)


Published in SPIE Proceedings Vol. 0334:
Optical Microlithography I: Technology for the Mid-1980s
Harry L. Stover, Editor(s)

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