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Proceedings Paper

User Requirements In Plasma Etch Equipment
Author(s): John M. Salzer
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Paper Abstract

Plasma etch equipment has made impressive headway in recent years, both technically andin the market place. The trend to ever finer lines and spaces in semiconductor manufacturing brought out the limitations of wet processing and has all but necessitated the development of dry methods. Indeed, the requirement for plasma processes arose so rapidly that the equipment andrrocess industries were not completely prepared. At the same time, the strong need and rapid market growth attracted a large number of companies to enter the business with a bewildering assortment of equipment and processes. These conditions have posed some difficult problems for the user, the wafer fabricator. On the one hand, due to lithographic resolution sliding toward 2 um and below, the semiconductor manufacturer finds being forced to purchase dry-etch equipment in growing volume. One the other hand, equipment and processes are still in development and new ones are being announced almost daily. The purpose of this paper is to improve communication between suppliers and users by surveying the user community and reflecting its unfilled needs. What is that the semiconductor manufacturer really requires in plasma equipment? How can the equipment maker improve its position? What are the problems with equipment already installed? What are the critical process parameters? What should the next generation equipment do and be like?

Paper Details

Date Published: 13 September 1982
PDF: 5 pages
Proc. SPIE 0334, Optical Microlithography I: Technology for the Mid-1980s, (13 September 1982); doi: 10.1117/12.933572
Show Author Affiliations
John M. Salzer, Salzer Technology Enterprises, Inc. (United States)

Published in SPIE Proceedings Vol. 0334:
Optical Microlithography I: Technology for the Mid-1980s
Harry L. Stover, Editor(s)

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