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Proceedings Paper

Characterization Data And Cross Matching Of A High Performance Step-And-Repeat Aligner
Author(s): Herbert E. Mayer; Ernst W. Loebach
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Paper Abstract

A wafer step-and-repeat alignment system, presented in 1980, is briefly reviewed 1, followed by a discussion emphasizing the aspects of cross-matching to wafer global alignment instruments. Issues relevant for cross-matching (wafer pre-alignment and exposure field fine-alignment) are covered in detail. Basic performance data for resolution, alignment accuracy, and throughput are given and first cross-matching results are reported.

Paper Details

Date Published: 13 September 1982
PDF: 10 pages
Proc. SPIE 0334, Optical Microlithography I: Technology for the Mid-1980s, (13 September 1982); doi: 10.1117/12.933570
Show Author Affiliations
Herbert E. Mayer, Censor Patent- and Versuchsanstalt (Liechtenstein)
Ernst W. Loebach, Censor Patent- and Versuchsanstalt (Liechtenstein)


Published in SPIE Proceedings Vol. 0334:
Optical Microlithography I: Technology for the Mid-1980s
Harry L. Stover, Editor(s)

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