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Proceedings Paper

Mix And Match-10x Reduction Wafer Steppers
Author(s): Adonis Stephanakis; Harry L. Coleman
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Paper Abstract

The ability to view an area of a wafer and 10X stepper reticle, simultaneously on axis, has been used to match different 10X reduction wafer steppers. This paper defines the problem and discusses test results. Operational parameters, global alignment, and intra-field die alignment are discussed. Wafer distortion and field distortion are examined. Registration data gathered from visual and computer diagnostics, which support the conclusions, are discussed.

Paper Details

Date Published: 13 September 1982
PDF: 7 pages
Proc. SPIE 0334, Optical Microlithography I: Technology for the Mid-1980s, (13 September 1982); doi: 10.1117/12.933569
Show Author Affiliations
Adonis Stephanakis, Advanced Micro Devices, Inc. (United States)
Harry L. Coleman, Eaton Optimetrix, Inc. (United States)


Published in SPIE Proceedings Vol. 0334:
Optical Microlithography I: Technology for the Mid-1980s
Harry L. Stover, Editor(s)

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