Share Email Print
cover

Proceedings Paper

Mix And Match Of 10:1 Wafer Steppers With Die-By-Die Alignment To 1:1 Proximity And Projection Systems
Author(s): H. L. Stover; N. E. David; T. H. Lewis
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

We report here the use of automatic die-by-die alignment to overlay 10:1 wafer-stepper images on patterns delineated by 1:1 proximity and projection systems. The motivation for these programs arises from considerations of cost-effectiveness and productivity while upgrading existing IC fab lines; 1:1 lithographic systems already in place can be used to generate non-critical layers, while the wafer steppers can be used to align and delineate the patterns of critical layers. Excellent intra-die overlay match is demonstrated, mixing with some of the more prevalent 1:1 systems. Practical issues relating to net wafer throughput are also illuminated.

Paper Details

Date Published: 13 September 1982
PDF: 12 pages
Proc. SPIE 0334, Optical Microlithography I: Technology for the Mid-1980s, (13 September 1982); doi: 10.1117/12.933568
Show Author Affiliations
H. L. Stover, TRE Semiconductor Equipment Corporation (United States)
N. E. David, TRE Semiconductor Equipment Corporation (United States)
T. H. Lewis, TRE Semiconductor Equipment Corporation (United States)


Published in SPIE Proceedings Vol. 0334:
Optical Microlithography I: Technology for the Mid-1980s
Harry L. Stover, Editor(s)

© SPIE. Terms of Use
Back to Top