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Proceedings Paper

Application Of Wafer Probe Techniques To The Evaluation Of Projection Printers
Author(s): C. P. Ausschnitt; T. A. Brunner; S. C. Yang
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Paper Abstract

As feature sizes and overlay tolerances shrink to keep pace with the increase in integrated circuit complexity, there is a concomitant need to advance the methods used to characterize and compare the performance of lithographic instruments. The electrical probe measurement technique has emerged as the most accurate, most effective approach to lithographic evaluation. We demonstrate the versatility of the technique as applied to state-of-the-art 1:1 projection printers. Among the characteristics of projection printers discussed are linewidth uniformity, focus and exposure latitude, pellicle mask protection, and distortion and alignment contributions to overlay accuracy.

Paper Details

Date Published: 13 September 1982
PDF: 9 pages
Proc. SPIE 0334, Optical Microlithography I: Technology for the Mid-1980s, (13 September 1982); doi: 10.1117/12.933555
Show Author Affiliations
C. P. Ausschnitt, The Perkin-Elmer Corporation (United States)
T. A. Brunner, The Perkin-Elmer Corporation (United States)
S. C. Yang, The Perkin-Elmer Corporation (United States)

Published in SPIE Proceedings Vol. 0334:
Optical Microlithography I: Technology for the Mid-1980s
Harry L. Stover, Editor(s)

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