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Proceedings Paper

Electron Beam Testing And Its Application To Packaging Modules For Very Large Scale Integrated (VLSI) Chip Arrays
Author(s): F. J. Hohn; T. H. P. Chang; D. Kern; W. Bruenger; P. Coane; M. Lindemann
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Paper Abstract

Electron Beam techniques, which have been applied for VLSI testing, are also useful for contactless testing of packaging modules. A test system has been developed to detect electrical opens and shorts in multilayer network wiring using specimens of 100 x 100 x 6mm in size. Various physical effects including charging, discharging, secondary electron emission and others allow a complete test to be performed. The contrast mechanism of the detected signal is based on the secondary electron yield vs. the beam potential and will be discussed in detail. Other signal mechanisms were also applied. By coordinating a pulsed electron beam in a vector mode to predetermined network terminals, computer controlled experiments were carried out. Results on the present status of this new testing approach will be presented.

Paper Details

Date Published: 30 June 1982
PDF: 6 pages
Proc. SPIE 0333, Submicron Lithography I, (30 June 1982); doi: 10.1117/12.933416
Show Author Affiliations
F. J. Hohn, IBM T. J. Watson Research Center (United States)
T. H. P. Chang, IBM T. J. Watson Research Center (United States)
D. Kern, IBM T. J. Watson Research Center (United States)
W. Bruenger, IBM T. J. Watson Research Center (United States)
P. Coane, IBM T. J. Watson Research Center (United States)
M. Lindemann, IBM T. J. Watson Research Center (United States)


Published in SPIE Proceedings Vol. 0333:
Submicron Lithography I
Phillip D. Blais, Editor(s)

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