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Proceedings Paper

Micromachined array-type Mirau interferometer for MEMS metrology
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Paper Abstract

We present the development of an array-type micromachined Mirau interferometers, operating in the regime of low coherence interferometry (LCI) and adapted for massively parallel inspection of MEMS. The system is a combination of free-space microoptical technologies and silicon micromachining, based on the vertical assembly of two glass wafers. The probing wafer is carrying an array of refractive microlenses, diffractive gratings to correct chromatic and spherical aberrations and reference micro-mirrors. The semitransparent beam splitter plate is based on the deposition of a dielectric multilayer, sandwiched between two glass wafers. The interferometer matrix is the key element of a novel inspection system aimed to perform parallel inspection of MEMS. The fabricated demonstrator, including 5x5 channels, allows consequently decreasing the measurement time by a factor of 25. In the following, the details of fabrication processes of the micro-optical components and their assembly are described. The feasibility of the LCI is demonstrated for the measurement of a wafer of MEMS sensors.

Paper Details

Date Published: 13 September 2012
PDF: 6 pages
Proc. SPIE 8494, Interferometry XVI: Applications, 849403 (13 September 2012); doi: 10.1117/12.932226
Show Author Affiliations
C. Gorecki, FEMTO-ST (France)
S. Bargiel, FEMTO-ST (France)
J. Albero, FEMTO-ST (France)
N. Passilly, FEMTO-ST (France)
M. Kujawinska, Warsaw Univ. of Technology (Poland)
U. D. Zeitner, Fraunhofer-Institut für Angewandte Optik und Feinmechanik (Germany)


Published in SPIE Proceedings Vol. 8494:
Interferometry XVI: Applications
Cosme Furlong; Christophe Gorecki; Erik L. Novak, Editor(s)

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