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Proceedings Paper

Simple Metal Lift-Off Process For 1 Micron Al/5% Cu Lines
Author(s): Tom Batchelder
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Paper Abstract

Two of the most challenging problems confronting processes aimed at 2μm pitch minimum geometries are: imaging on highly reflective,grainy metals and the subsequent anisotropic plasma etch of aluminum or aluminum alloys. Metal lift off processes can eliminate these difficulties altogether by reversing the normal procedure for metalization. "Metal Lift Off" refers to processes in which the metal or metal alloy layer is deposited over the photoresist image and then the unwanted metal is removed by dissolving away the photoresist and lifting off the excess metal by suitable mechanical means (Fig. 1).

Paper Details

Date Published: 28 July 1981
PDF: 7 pages
Proc. SPIE 0275, Semiconductor Microlithography VI, (28 July 1981); doi: 10.1117/12.931885
Show Author Affiliations
Tom Batchelder, National Semiconductor Corporation (United States)


Published in SPIE Proceedings Vol. 0275:
Semiconductor Microlithography VI
James W. Dey, Editor(s)

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