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Proceedings Paper

New melt-processable thermoplastic polyimides for opto-electronic applications
Author(s): Aditya Narayanan; Gurulingamurthy Haralur
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Paper Abstract

The rapid development and adoption of digital technology is leading to an increase in demand for smaller, faster digital data devices and faster digital telecommunication networks. This trend requires increased network bandwidth to handle large amounts of data and seamless integration of network devices with compatible end-user devices. This need is being met by using fiber-optic and photonics technology, infra-red (IR) signals to transmit information, and is fundamental changing the communication industry, thereby creating a need for new polymeric materials. New ULTEM* polyetherimide (PEI) and EXTEM* thermoplastic polyimide (TPI) resins meet the material requirements for the optoelectronics industry. These resins have building blocks enabling IR light transmission without degrading signal quality. They can be injection-molded into thin, precision optical lenses and connectors. ULTEM* resins are been widely used in this industry as fiber-optic components in trans-receivers. EXTEM* resins are amenable to lead-free soldering (LFS), a greener industrial assembly process. While still being IR-transparent, EXTEM* resin is an ideal material for LFS capable substrates, connectors and lenses. An optical product portfolio has been developed and is being presented as a solution to the opto-electronics component industry and some of the successful applications therein.

Paper Details

Date Published: 19 October 2012
PDF: 9 pages
Proc. SPIE 8489, Polymer Optics and Molded Glass Optics: Design, Fabrication, and Materials II, 84890E (19 October 2012); doi: 10.1117/12.927984
Show Author Affiliations
Aditya Narayanan, SABIC (United States)
Gurulingamurthy Haralur, SABIC (United States)


Published in SPIE Proceedings Vol. 8489:
Polymer Optics and Molded Glass Optics: Design, Fabrication, and Materials II
David H. Krevor; William S. Beich; Michael P. Schaub; Stefan M. Bäumer, Editor(s)

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