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Proceedings Paper

Multiple column high-throughput e-beam inspection (EBI)
Author(s): David K. Lam; Kevin M. Monahan; Enden D. Liu; Cong Tran; Ted Prescop
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Paper Abstract

Single-column e-beam systems are used in production for the detection of electrical defects, but are too slow to be used for the detection of small physical defects, and can't meet future inspection requirements. This paper presents a multiplecolumn e-beam technology for high throughput wafer inspection. Multibeam has developed all-electrostatic columns for high-resolution imaging. The elimination of magnetic coils enables the columns to be small; e-beam deflection is faster in the absence of magnetic hysteresis. Multiple miniaturecolumns are assembled in an array. An array of 100 columns covers the entire surface of a 300mm wafer, affording simultaneous cross-wafer sampling. Column performance simulations and system architecture are presented. Also provided are examples of high throughput, more efficient, multiple-column wafer inspection.

Paper Details

Date Published: 5 April 2012
PDF: 6 pages
Proc. SPIE 8324, Metrology, Inspection, and Process Control for Microlithography XXVI, 83240G (5 April 2012); doi: 10.1117/12.927032
Show Author Affiliations
David K. Lam, Multibeam Corp. (United States)
Kevin M. Monahan, Quantgain Strategies (United States)
Enden D. Liu, Multibeam Corp. (United States)
Cong Tran, Multibeam Corp. (United States)
Ted Prescop, Multibeam Corp. (United States)


Published in SPIE Proceedings Vol. 8324:
Metrology, Inspection, and Process Control for Microlithography XXVI
Alexander Starikov, Editor(s)

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