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Proceedings Paper

Development of light-scattering thermal cross-linking package film based on self-assembly for liquid crystal display using light emitting diode
Author(s): Satoshi Takei; Kazuhide Mochizuki; Naoya Kubo; Yoshiyuki Yokoyama
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Paper Abstract

We present investigations of light-scattering thermal cross-link package film based on self-assembly for liquid crystal display using light emitting diode. Thermal cross-link package films based on selfassembly indicated good nano regularly-structured patterning for light-scattering, excellent environmental stability of optical parameters, and solvent intermixing resistance after thermal cross-link reaction. The developed light-scattering thermal cross-link package film-s based on self-assembly is one of the most promising processes ready to be incorporated into the mass production of patterning light-scattering optical layer for advanced liquid crystal display, organic electroluminescent display, and solar cell devices.

Paper Details

Date Published: 9 May 2012
PDF: 9 pages
Proc. SPIE 8428, Micro-Optics 2012, 84281T (9 May 2012); doi: 10.1117/12.924633
Show Author Affiliations
Satoshi Takei, Toyama Prefectural Univ. (Japan)
Osaka Univ. (Japan)
Kazuhide Mochizuki, Toyama Prefectural Univ. (Japan)
Naoya Kubo, Toyama Prefectural Univ. (Japan)
Yoshiyuki Yokoyama, Toyama Industrial Technology Ctr. (Japan)


Published in SPIE Proceedings Vol. 8428:
Micro-Optics 2012
Hugo Thienpont; Jürgen Mohr; Hans Zappe; Hirochika Nakajima, Editor(s)

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