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Proceedings Paper

Advanced thermal management technologies for defense electronics
Author(s): Kristen P. Bloschock; Avram Bar-Cohen
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Paper Abstract

Thermal management technology plays a key role in the continuing miniaturization, performance improvements, and higher reliability of electronic systems. For the past decade, and particularly, the past 4 years, the Defense Advanced Research Projects Agency (DARPA) has aggressively pursued the application of micro- and nano-technology to reduce or remove thermal constraints on the performance of defense electronic systems. The DARPA Thermal Management Technologies (TMT) portfolio is comprised of five technical thrust areas: Thermal Ground Plane (TGP), Microtechnologies for Air-Cooled Exchangers (MACE), NanoThermal Interfaces (NTI), Active Cooling Modules (ACM), and Near Junction Thermal Transport (NJTT). An overview of the TMT program will be presented with emphasis on the goals and status of these efforts relative to the current State-of-the-Art. The presentation will close with future challenges and opportunities in the thermal management of defense electronics.

Paper Details

Date Published: 3 May 2012
PDF: 12 pages
Proc. SPIE 8405, Defense Transformation and Net-Centric Systems 2012, 84050I (3 May 2012); doi: 10.1117/12.924349
Show Author Affiliations
Kristen P. Bloschock, System Planning Corp. (United States)
Avram Bar-Cohen, Defense Advanced Research Projects Agency (United States)


Published in SPIE Proceedings Vol. 8405:
Defense Transformation and Net-Centric Systems 2012
Raja Suresh, Editor(s)

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