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Proceedings Paper

Design of vertical packaging technology for RF MEMS switch
Author(s): Deepak Bansal; Akshdeep Sharma; Maninder Kaur; K. J. Rangra
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Paper Abstract

Wafer-level micro-encapsulation is an innovative, low-cost, wafer-level packaging method for encapsulating RF MEMS switches. This article presents an approach for design and processing steps related to encapsulation of individual RF components e.g. CPW, RF MEMS switches, in view of the variation in performance subsequent to packaging. Bottom contact vertical packaging is more prone to misalignment margin and easy to make connections. Cavity height of 30 µm is optimized for bottom contact vertical packaging.

Paper Details

Date Published: 15 October 2012
PDF: 6 pages
Proc. SPIE 8549, 16th International Workshop on Physics of Semiconductor Devices, 854911 (15 October 2012); doi: 10.1117/12.924260
Show Author Affiliations
Deepak Bansal, Central Electronics Engineering Research Institute (India)
Akshdeep Sharma, Central Electronics Engineering Research Institute (India)
Maninder Kaur, Central Electronics Engineering Research Institute (India)
K. J. Rangra, Central Electronics Engineering Research Institute (India)


Published in SPIE Proceedings Vol. 8549:
16th International Workshop on Physics of Semiconductor Devices
Monica Katiyar; B. Mazhari; Y N Mohapatra, Editor(s)

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