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Proceedings Paper

Piezoelectric cantilevers energy harvesting in MEMS technique
Author(s): Yingqi Shang; Chengjun Qiu; Hongmei Liu; Xiaojie Chen; Wei Qu; Yanwei Dou
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Paper Abstract

Piezoelectric cantilevers energy harvesting made by micro-electromechanical system (MEMS) technology can scavenge power from low-level ambient vibration sources. The developed cantilevers energy harvesting are featured with resonate frequency and power output in microwatt level, which is sufficient to the self-supportive sensors for in-service integrity monitoring of large social and environmental infrastructures at remote locations. In this paper, piezoelectric energy harvesting based on thick-film piezoelectric cantilevers is investigated to resonate at specific frequencies of an external vibration energy source, which creating electrical energy via the piezoelectric effect. Our cantilever device has a multiple structure with a proof mass added to the end. The thick film lead zirconate titanate Pb(Zr,Ti)O3 (PZT) coated on the top of Au/Cr/SiO2/Si substrates by sol-gel-spin method. The thickness of the PZT membrane was up to 2μm and the cantilevers substrates thickness 50μm, wideness 1.5mm, length 4mm. The Au/Ti top electrode is patterned on top of the sol-gel-spin coated PZT thick film in order to employ the d31 mode. The prototype energy generator has a measured performance of 0.74μW effective electrical power, and 4.93 DC output voltages to resistance load. The effect of proof mass, beam shape and damping on the power generating performance are modeled to provide a design guideline for maximum power harvesting from environmentally available low frequency vibrations. A multiple structure cantilever is designed to achieve compactness, low resonant frequency and minimum damping coefficient, simultaneously. This device is promising to support networks of ultra-low-power sensor.

Paper Details

Date Published: 13 April 2012
PDF: 5 pages
Proc. SPIE 8409, Third International Conference on Smart Materials and Nanotechnology in Engineering, 840927 (13 April 2012); doi: 10.1117/12.923423
Show Author Affiliations
Yingqi Shang, The Key Lab. of Electronics Engineering College of Heilongjiang Province (China)
Chengjun Qiu, Heilongjiang Univ. (China)
Hongmei Liu, Heilongjiang Univ. (China)
Xiaojie Chen, Heilongjiang Univ. (China)
Wei Qu, The Key Lab. of Electronics Engineering College of Heilongjiang Province (China)
Yanwei Dou, Heilongjiang Univ. (China)


Published in SPIE Proceedings Vol. 8409:
Third International Conference on Smart Materials and Nanotechnology in Engineering

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