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Proceedings Paper

Integrated cleaning and handling automation of NXE3100 reticles
Author(s): Rik Jonckheere; Tobias Waehler; Bart Baudemprez; Uwe Dietze; Peter Dress; Oliver Brux; Kurt Ronse
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Paper Abstract

This paper focuses on imec's activities to minimize particle contamination on reticles (front- and backside) for the latest EUVL scanner, i.e. the NXE3100. Mask cleaning is performed on the HamaTech MaskTrack Pro® (MTP). Although also front-side particles and other contamination are being tackled by cleaning, the prime purpose is the avoidance of back-side particles which would lead to unacceptable overlay performance of the scanner and hence create yield loss, as well as cause unscheduled scanner down situations for cleaning of the reticle clamp. In the absence of a soft pellicle, the present approach to minimize particle adders during handling is to load EUV reticles into the scanner via so-called dual pods. The inner pod as such acts as a removable hard pellicle. Through the installation of the HamaTech MaskTrack Pro InSync® tool, interfaced to the MaskTrack Pro Cleaner, automated handling of EUV reticles in such pods is enabled. This integrated solution for handling and storage is additionally being equipped with an integrated reticle back-side inspection capability.

Paper Details

Date Published: 16 April 2012
PDF: 12 pages
Proc. SPIE 8352, 28th European Mask and Lithography Conference, 83520U (16 April 2012); doi: 10.1117/12.923321
Show Author Affiliations
Rik Jonckheere, IMEC (Belgium)
Tobias Waehler, HamaTech APE GmbH & Co. KG (Germany)
Bart Baudemprez, IMEC (Belgium)
Uwe Dietze, SUSS MicroTec Inc. (United States)
Peter Dress, HamaTech APE GmbH & Co. KG (Germany)
Oliver Brux, HamaTech APE GmbH & Co. KG (Germany)
Kurt Ronse, IMEC (Belgium)

Published in SPIE Proceedings Vol. 8352:
28th European Mask and Lithography Conference
Uwe F.W. Behringer; Wilhelm Maurer, Editor(s)

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