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Proceedings Paper

Effect of clay modification on the morphological, mechanical, and thermal properties of epoxy/polypropylene/montmorillonite shape memory materials
Author(s): Huifeng Tan; He Sun; Yuyan Liu; Linbao Tong; Xingwen Du
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Paper Abstract

A series of montmorillonite (DK2) modified shape memory polyurethane-epoxy (UEP) composites had been prepared. The effect of DK2 modification on the morphological, mechanical and thermal properties of epoxy/polypropylene/Montmorillonite nano-composites were characterized using X-ray diffraction (XRD), transmission electron microscopy (TEM), tensile test, scanning electron microscope (SEM) and dynamic mechanical analysis (DMA). The shape memory performance was investigated by fold-deploy shape memory tests. The XRD and TEM results indicated the formation of exfoliated structure for epoxy/polypropylene nano-composites had been prepared using 2~ 3wt.% DK2. On the other hand, a mixture of intercalated and exfoliated structure was found in 4~5wt.% DK2/ epoxy/polypropylene polymers. Further more, the toughness, tensile strength, enlongation at break had been improved by adding DK2, while glass transition temperature, storage modulus and shape recovery ratio was unaffected. The composite materials possessed excellent shape memory properties, they could fully recover their original shapes within 3 min under the maximum bending angle of 180°, and there were little effect by fold-deploy ten times.

Paper Details

Date Published: 12 April 2012
PDF: 11 pages
Proc. SPIE 8409, Third International Conference on Smart Materials and Nanotechnology in Engineering, 84091Z (12 April 2012); doi: 10.1117/12.923306
Show Author Affiliations
Huifeng Tan, Harbin Institute of Technology (China)
He Sun, Harbin Institute of Technology (China)
Yuyan Liu, Harbin Institute of Technology (China)
Linbao Tong, Harbin Institute of Technology (China)
Xingwen Du, Harbin Institute of Technology (China)


Published in SPIE Proceedings Vol. 8409:
Third International Conference on Smart Materials and Nanotechnology in Engineering
Jinsong Leng; Yoseph Bar-Cohen; In Lee; Jian Lu, Editor(s)

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