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Proceedings Paper

Study on the cell size effect of steady state thermal performance of metallic honeycomb sandwich panels
Author(s): Yu-dong Lai; Shi-ping Sun
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Paper Abstract

In this paper, numerical study is performed to reveal the influences of the cell size on the steady state thermal performance of hexagonal metallic honeycomb sandwich panel, by using the semi-empirical Swann and Pittman formula and the Finite Element Method (FEM), respectively. Based on the same material volume of honeycomb core, two types of hexagonal honeycomb core, i.e., size variation of core cell with a constant core height and height variation of core with a constant side length of hexagonal cell, are considered to establish the panel's thermal analysis model, which including the conduction and radiation coupling. Comparisons between the temperature distribution results from both methods show that FEM can reveal the size effect of the honeycomb cell on the thermal performances of sandwich panel while the Swann and Pittman formula can not. At the same time, numerical results show that for the core with constant height, the panel thermal performance analyzed by FEM has a tendency of being close to the results obtained from Swann and Pittman formula as the core cell size decreases; whereas, if the hexagonal cell with constant side length is concerned, the greater the core height, the worse the thermal conductive performance of sandwich panel. Besides, analyses based on both methods also show that the temperature distribution of the lower surface of panel becomes gradually uniform when the wall thickness of hexagonal cell decreases.

Paper Details

Date Published: 13 April 2012
PDF: 6 pages
Proc. SPIE 8409, Third International Conference on Smart Materials and Nanotechnology in Engineering, 84092H (13 April 2012); doi: 10.1117/12.921528
Show Author Affiliations
Yu-dong Lai, Nanchang Hangkong Univ. (China)
Shi-ping Sun, Nanchang Hangkong Univ. (China)


Published in SPIE Proceedings Vol. 8409:
Third International Conference on Smart Materials and Nanotechnology in Engineering
Jinsong Leng; Yoseph Bar-Cohen; In Lee; Jian Lu, Editor(s)

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