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Proceedings Paper

Deformation of polystyrene nanoparticles under different AFM tapping loads
Author(s): Bo-Ching He; Wei-En Fu; Huay-Chung Liou; Yong-Qing E. Chang; Shan-Peng Pan; Hung Min Lin; Yen-Fu Chen
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Paper Abstract

Deformation induced by contact force from the tip is the major measurement uncertainty using atomic force microscope (AFM) for the apex height of nanoparticles. Additionally, the contact force by the AFM tip is difficult and not reliable in traditional tapping and contact modes. In this work, the contact forces applied by the AFM were varied using a peak-force tapping method, which is unique technique to perform force-controlled scanning, to characterize the deformation of nanoparticles. The obtained measurement results were compared with a theoretical model developed for predicting the deformation between PS nanoparticles and tip/substrate. It was found that the deformation occurred at low force as 0.5 nN for polystyrene nanoparticles on mica substrate. The deformation was fully plastic. In addition, the deformation has a linear relationship with contact force, which is consistent with contact mechanics model.

Paper Details

Date Published: 14 May 2012
PDF: 9 pages
Proc. SPIE 8378, Scanning Microscopies 2012: Advanced Microscopy Technologies for Defense, Homeland Security, Forensic, Life, Environmental, and Industrial Sciences, 83780G (14 May 2012); doi: 10.1117/12.921451
Show Author Affiliations
Bo-Ching He, Industrial Technology Research Institute (Taiwan)
Wei-En Fu, Bruker Taiwan/Nano Surface (Taiwan)
Huay-Chung Liou, Industrial Technology Research Institute (Taiwan)
Yong-Qing E. Chang, Industrial Technology Research Institute (Taiwan)
Shan-Peng Pan, Industrial Technology Research Institute (Taiwan)
Hung Min Lin, Bruker Taiwan/Nano Surface (Taiwan)
Yen-Fu Chen, Bruker Taiwan/Nano Surface (Taiwan)


Published in SPIE Proceedings Vol. 8378:
Scanning Microscopies 2012: Advanced Microscopy Technologies for Defense, Homeland Security, Forensic, Life, Environmental, and Industrial Sciences
Michael T. Postek; Dale E. Newbury; S. Frank Platek; David C. Joy; Tim K. Maugel, Editor(s)

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